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this is information on a product in full production. july 2015 docid023247 rev 6 1/14 stpsc6h065 650 v power schottky silicon carbide diode datasheet - production data features ? no reverse recovery charge in application current range ? switching behavior independent of temperature ? dedicated to pfc applications ? high forward surge capability ? insulated package to-220ac ins: ? insulated voltage: 2500 v rms ? typical package capacitance: 7 pf description the sic diode is an ultrahigh performance power schottky diode. it is manufactured using a silicon carbide substrate. the wide band gap material allows the design of a schottky diode structure with a 650 v rating. due to the schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. the minimal capacitive turn-off behavior is independent of temperature. especially suited for use in pfc applications, this st sic diode will boost the performance in hard switching conditions. its high forward surge capability ensures a good robustness during transient phases. . . $ . . $ $ 1& 1& . $ . $ table 1. device summary symbol value i f(av) 6 a v rrm 650 v t j (max) 175 c www.st.com
characteristics stpsc6h065 2/14 docid023247 rev 6 1 characteristics to evaluate the conduction losses use the following equation: p = 1.35 x i f(av) + 0.192 x i f 2 (rms) table 2. absolute ratings (limiting values at 25 c unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 650 v i f(rms) forward rms current 22 a i f(av) average forward current to-220ac, dpak, d 2 pak, t c = 135 c (1) , dc 6 a to-220ac ins, t c = 110 c (1) , dc i fsm surge non repetitive forward current t p = 10 ms sinusoidal, t c = 25 c t p = 10 ms sinusoidal, t c = 125 c t p = 10 s square, t c = 25 c 60 52 400 a i frm repetitive peak forward current to-220ac, dpak, d 2 pak, t c = 135 c (1) , t j = 175 c, = 0.1 25 a to-220ac ins, t c = 110 c (1) , t j = 175 c, = 0.1 t stg storage temperature range -55 to +175 c t j operating junction temperature (2) -40 to +175 c 1. value based on r th(j-c) max. 2. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistance symbol parameter typ. value max. value unit r th(j-c) junction to case to-220ac, dpak, d 2 pak 1.6 2.4 c/w to-220ac ins 2.9 4.2 table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm -560 a t j = 150 c - 50 250 v f (2) forward voltage drop t j = 25 c i f = 6 a -1.561.75 v t j = 150 c - 1.98 2.5 1. t p = 10 ms, < 2% 2. t p = 500 s, < 2%
docid023247 rev 6 3/14 stpsc6h065 characteristics 14 table 5. other parameters symbol parameter test conditions typ. unit q cj (1) total capacitive charge v r = 400 v 18 nc c j total capacitance v r = 0 v, t c = 25 c, f = 1 mhz 300 pf v r = 400 v, t c = 25 c, f = 1 mhz 30 1. most accurate value for the capacitive charge: q = c j (v r ).dv r cj v out 0 figure 1. forward voltage drop versus forward current (typical values, low level) figure 2. forward voltage drop versus forward current (typical values, high level) 0 2 4 6 8 10 12 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 t a =150 c t a =175 c t a =25 c pulse test : t p =500s t a =100 c a) i f ( v f (v) 0 10 20 30 40 50 60 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 t a =150 c t a =175 c t a =25 c pulse test : t p =500s t a =100 c a) i f ( v f (v) figure 3. reverse leakage current versus reverse voltage applied (typical values) figure 4. peak forward current versus case temperature (to-220ac, dpak, d2pak) i r (a) 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 50 100 150 200 250 300 350 400 450 500 550 600 650 t j =25 c t j =150 c t j =175 c v r (v) i m (a) 0 10 20 30 40 50 60 70 0 25 50 75 100 125 150 175 = 0.1 = 0.3 = 0.5 = 1 = 0.7 t c (c) t =tp/t tp i m
characteristics stpsc6h065 4/14 docid023247 rev 6 figure 5. peak forward current versus case temperature (to-220ac ins) figure 6. junction capacitance versus reverse voltage applied (typical values) i m (a) 0 10 20 30 40 50 0 25 50 75 100 125 150 175 = 0.1 = 0.3 = 0.5 = 1 = 0.7 t c (c) t =tp/t tp i m 0 50 100 150 200 250 300 0.1 1.0 10.0 100.0 1000.0 f=1 mhz v osc =30 mv rms t j =25 c v r (v) c j (pf) figure 7. relative variation of thermal impedance junction to case versus pulse duration (to-220ac, dpak and d2pak) figure 8. relative variation of thermal impedance junction to case versus pulse duration (to-220ac ins) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 z th(j-c) /r th(j-c) single pulse t p (s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 single pulse z th(j-c) /r th(j -c) t p (s) figure 9. non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) figure 10. total capacitive charges versus reverse voltage applied (typical values) 1.e+01 1.e+02 1.e+03 1.e-05 1.e-04 1.e-03 1.e-02 i fsm (a) t a =25 c t a =125 c t p (s) 0 4 8 12 16 20 0 50 100 150 200 250 300 350 400 q cj (nc) v r (v)
docid023247 rev 6 5/14 stpsc6h065 package information 14 2 package information ? epoxy meets ul94, v0 ? recommended torque value: 0.55 nm ? maximum torque value: 0.7 nm ? cooling method: conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 to-220ac package information figure 11. to-220ac package outline a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
package information stpsc6h065 6/14 docid023247 rev 6 table 6. to-220ac package mechanical data ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151
docid023247 rev 6 7/14 stpsc6h065 package information 14 2.2 to-220ac ins package information figure 12. to-220ac ins package outline c b2 c2 f ? i l a a1 a2 b e b1 i4 l2 c1 m
package information stpsc6h065 8/14 docid023247 rev 6 table 7. to-220ac ins package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551 b 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 c 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 f 6.20 6.60 0.244 0.259 ?i 3.75 3.85 0.147 0.151 i4 15.80 16.40 16.80 0.622 0.646 0.661 l 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 m 2.60 0.102
docid023247 rev 6 9/14 stpsc6h065 package information 14 2.3 dpak package information figure 13. dpak package outline l1 l a1 r r d d1 d c a c2 v2 a2 h l4 e1 e b l2 e b4 e1 gauge plane 0.25
package information stpsc6h065 10/14 docid023247 rev 6 figure 14. footprint (dimensions in mm) table 8. dpak package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 d1 5.10 0.201 e 6.40 6.60 0.251 0.259 e1 4.70 0.185 e2.28 0.090 e1 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l 1.00 1.50 0.039 0.059 l1 2.80 0.11 l2 0.80 0.032 l4 0.60 1.00 0.023 0.039 r0.2 0.008 v2 0 8 0 8 6.3 6.1 10.7 2.8 1.5 4.572 a b this footprint ensures insultation up to 630 v rms (according to iec 664-1) the device must be positioned within 0.05 a b
docid023247 rev 6 11/14 stpsc6h065 package information 14 2.4 d2pak package information figure 15. d 2 pak package outline g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 *
package information stpsc6h065 12/14 docid023247 rev 6 figure 16. footprint (dimensions in mm) table 9. d 2 pak package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 a 4.40 a1 2.49 2.69 0.098 0.106 a1 2.49 a2 0.03 0.23 0.001 0.009 a2 0.03 b 0.70 0.93 0.027 0.037 b 0.70 b2 1.14 1.70 0.045 0.067 b2 1.14 c 0.45 0.60 0.017 0.024 c 0.45 c2 1.23 1.36 0.048 0.054 c2 1.23 d 8.95 9.35 0.352 0.368 d 8.95 e 10.00 10.40 0.393 0.409 e 10.00 g 4.88 5.28 0.192 0.208 g 4.88 l 15.00 15.85 0.590 0.624 l 15.00 l2 1.27 1.40 0.050 0.055 l2 1.27 l3 1.40 1.75 0.055 0.069 l3 1.40 m 2.40 3.20 0.094 0.126 m 2.40 r0.40 0.016 v2 0 8 0 8 16.90 10.30 8.90 3.70 5.08 1.30
docid023247 rev 6 13/14 stpsc6h065 ordering information 14 3 ordering information 4 revision history table 10. ordering information order code marking package weight base qty delivery mode stpsc6h065d stpsc6h065d to-220ac 1.86 g 50 tube stpsc6h065di stpsc 6h065di to-220ac ins 2.12 g 50 tube STPSC6H065G-TR stpsc6h065g d 2 pak 1.48 g 1000 tape and reel stpsc6h065b-tr stpsc 6h065 dpak 0.32 g 2500 tape and reel table 11. document revision history date revision changes 18-jun-2012 1 first issue. 31-aug-2012 2 added diode configuration graphic on front page. updated value of q cj and footnote equation in table 5 . 10-oct-2012 3 added max. value in table 3 . 07-nov-2013 4 updated figure 1 , figure 2 , figure 13 , figure 14 , and table 8 . 07-jan-2014 5 added to-220ac ins package. 22-jul-2015 6 updated table 10 and reformatted to current standard.
stpsc6h065 14/14 docid023247 rev 6 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved

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